Çapraz cam (TGV) cam

sohbet Bizimle iletişim kur

Çapraz cam (TGV) cam

Diğer Videolar

May 31, 2024

Kategori Bağlantısı: Safir Yüzey

sohbet Bizimle iletişim kur

Etiketler:

#safir gofret #silikon substrat #safir malzeme

Kısa: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.

İlgili Ürün Özellikleri:

Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
200 mm çapına kadar olan waferler için uyarlanabilir.
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.

SSS:

What is Through Glass Via (TGV) technology?

TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
Yarı iletkenlerde TGV'nin uygulamaları nelerdir?

Yarı iletkenlerde, TGV teknolojisi, 5G, IoT ve sensör paketleme gibi uygulamalarda yüksek yoğunluklu entegrasyon, yüksek frekans performansı ve gelişmiş termal ve mekanik kararlılık için kullanılır.
What materials are compatible with TGV technology?

TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.